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HPCIE-Q470
Maximizes Design Flexibility
The HPCIE-Q470 is a half-size PICMG 1.3 SBC supporting 10th/11th generation Intel® Core™, Pentium® or Celeron® processor with Intel® Q470 chipset. Aimed at customers who are seeking compact system with high computing power and flexible expansion capabilities.
With versatile IEI passive backplanes and industrial chassis options, the compact configurable system offers increased computing efficiency, flexible I/O expandability especailly with PCIe x16 , PCIe x8 and legacy PCI signals through backplane allowing more industrial add-on cards to satisfy the requirements of performance-demanding applications in quality defect inspection, digital surveillance, transportation and automation applications.
Spec Overview
Performance
Connectivity
Cooling
Component Side
- Two 260-pin 2933 MHz dual-channel
DDR4 SO-DIMMs
support up to 64GB - 12V CPU DC input
- 1 x M.2 2230 A key slot
(PCIe Gen3 x2 + USB 2.0) - LGA1200 socket for 10th/11th Gen
Intel® Core™, Pentium® and
Celeron® processors - Intel® Q470/Q470E
Solder Side
- 1x M.2 2242/2280 M key slot (PCIe Gen3 x4)
- 2 x RS-232/422/485 (RS-485 supports AFC)
- 2 x SATA 6Gbps ports (RAID 0/1)
- Front Panel
- DIO
- IAUDIO for AC-KIT-888S 7.1 channel HD Audio kit
- 2 x 2.5GbE via Intel® I225V
- 1 x HDMI™ 1.4b (4096 x 2160 @30Hz)
- 1 x USB 3.2 Gen 2 (10Gb/s) by USB Type-C connector
- 2 x USB 3.2 Gen 1 (5Gb/s)
- 2 x USB 2.0
Performance
- 1Two 260-pin 2933 MHz dual-channel DDR4 SO-DIMMs, support up to 64GB
- 212V CPU DC input
- 31 x M.2 2230 A key slot (PCIe Gen3 x2 + USB 2.0)
- 4LGA1200 socket for 10th/11th Gen Intel® Core™, Pentium® and Celeron® processors
- 5Intel® Q470/Q470E
Component Side
- 6One 260-pin 2933 MHz dual-channel DDR4 SO-DIMM supporting up to 16 GB
Solder Side
Connectivity
- 12 x RS-232/422/485(RS-485 supports AFC)
- 22 x SATA 6Gbps ports (RAID 0/1)
- 3Front Panel
- 4DIO
- 5IAUDIO for AC-KIT-888S 7.1 channel HD Audio kit
- 62 x 2.5GbE via Intel® I225V
- 71 x HDMI™ 1.4b (4096 x 2160 @30Hz)
- 81 x USB 3.2 Gen 2(10Gb/s) by USB Type-C connector
- 92 x USB 3.2 Gen 1 (5Gb/s)
- 102 x USB 2.0
Half-size PICMG 1.3
Standard PICMG 1.3 SBCs have several advantages over non-standard SBCs. Firstly, they are more maintainable than a motherboard system and have a much lower mean time to repair (MTTR). Secondly, it is easy to upgrade to a newer or faster processor if desired.
Features of PICMG 1.3:
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20 PCI Express
20 PCI Express lanes are supported, including PCI Express x16, x8, x4 and x1 configurations -
ATX power signals are supported
Provides AUX voltages for standby power and sleep states (soft starts, wake on LAN), supports PSON#, PWRGD, PWRRBT# and ACPI states
Various backplane configuration options are provided by the PICMG 1.3 specification to meet the different needs encountered in embedded computing applications.
Enhanced CPU Performance
The performance boosts up to 80% better than previous generation on i5 processor. The 10th Gen Intel® Core platform supports up to 10 cores and improved performance over Coffee Lake-Refresh. With increased I/O capacity and the latest DDR4-2933 memory support, these processors deliver the performance required to consolidate industrial multiple workloads.
Embedded CPU Support List for 10th Gen Intel® Processors
Sockets | Brand | Process | Cores/Threads | CPU | Processor Base Frequency | Cache | TDP | Processor Graphics | Graphics Base Frequency | Memory Types | Chipset |
---|---|---|---|---|---|---|---|---|---|---|---|
FCLGA1200 | CoreTM i9 | 14nm Comet Lake-S | 10/20 | I9-10900E | 2.8 GHz | 20MB | 65W | Intel® UHD Graphics 630 | 350 MHz | DDR4-2933 | Q470/Q470E |
10/20 | I9-10900TE | 1.8 GHz | 20MB | 35W | DDR4-2933 | ||||||
CoreTM i7 | 8/16 | I7-10700E | 2.9 GHz | 16MB | 65W | DDR4-2933 | |||||
8/16 | I7-10700TE | 2.0 GHz | 16MB | 35W | DDR4-2933 | ||||||
CoreTM i5 | 6/12 | I5-10500E | 3.1 GHz | 8MB | 65W | DDR4-2666 | |||||
CoreTM i5 | 6/12 | I5-10500TE | 2.3 GHz | 8MB | 35W | DDR4-2666 | |||||
CoreTM i3 | 4/8 | I3-10100E | 3.2 GHz | 9MB | 65W | DDR4-2666 | |||||
CoreTM i3 | 4/8 | I3-10100TE | 2.3 GHz | 9MB | 35W | DDR4-2666 | |||||
Pentium® | 2/4 | G6400E | 3.8 GHz | 4MB | 58W | DDR4-2400 | |||||
Pentium® | 2/4 | G6400TE | 3.2 GHz | 4MB | 35W | DDR4-2400 | |||||
Celeron® | 2/2 | G5900E | 3.2 GHz | 2MB | 58W | DDR4-2400 | |||||
Celeron® | 2/2 | G5900TE | 3.0 GHz | 2MB | 35W | DDR4-2400 |
Delivering HDMI™ 4K Resolution for Real-time Monitoring
Equipped with Intel® UHD Graphics to display videos and images in stunning 4K (4096x2160 @30 Hz) resolutions.
Connectivity
10 Gb/s USB 3.2 Gen 2 Type-C foolproof connector
USB Type-C connectors are widely adopted by many electronic devices, such as portable SSD hard drives, smart phones, USB cameras, etc. The HPCIE-Q470 uses the reversible connector that should end the bane of users fiddling at the back of computers.
SATA 6 Gb/s Storage Performance with RAID 0/1 Protection
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Vibration free lockable SATA connectors and cables to protect the connection between HDD and SBC
-
RAID 1 with mirror function provides redundancy data protection
-
RAID 0 enables faster storage performance with data striping to protect against data loss from a hard drive failure by mirroring all data across multiple devices.
-
SATA 6Gb/s is well suited for such as video editing because they require high performance to memory.
RAID 0 Speed Mode
RAID 0 mode (stripping) provides higher data reading and writing performances by dividing a single file into two files and storing one on each drive.
RAID 1 Safe Mode
RAID 1 mode (mirroring) backs up the identical data in
both drives to prevent data loss from hard drive failure.
Networking
M.2 2230 A Key for Wi-Fi/Bluetooth
The M.2 2230 A key slot carrying with PCIe 3.0 x1 and USB 2.0 signals allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks.
Delivering Dual Low-Latency 2.5G LAN Powered by Intel
The two on-board Intel® I225V 2.5GbE controllers enable the HPCIE-Q470 to meet the bandwidth-intensive requirements such as large file transfers and high-resolution video streaming.
Instant System-level Solution
To suit different AIoT applications, IEI offers a comprehensive range of PICMG 1.3 passive backplanes and industrial chassis to give system designers expanded options for integrating multi-level processors within a variety of configurations.
Hardware Spec.
Form Factor | |
---|---|
Form Factor | Half Size Single Board Computer |
System | |
CPU | LGA1200 Intel® 10th/11th Gen. Core™ i9/i7/i5/i3,Pentium® and Celeron® processor(Support up to 65w) |
Chipset | Intel® Q470/Q470E |
Memory | 2 x 260-pin 2933 MHz Dual-channel DDR4 SO-DIMM,support up to 64G |
Memory Max. | up to 64GB |
Cooling method / System Fan | 1 x CPU fan connector (1x4 pin) |
Physical Characteristics | |
Dimensions (LxWxH) (mm) | 185 mm x 126 mm |
Net Weight | 420g |
Storage | |
Storage | 2 x SATA : 6Gb/s (support RAID 0/1) |
1 x M.2(NGFF) : M Key (2242/2280) with PCIe Gen3 x4 ,support NVME storage | |
I/O Interface | |
Display Output | 1 x HDMI™ : up to 4096 x 2160@30Hz |
Ethernet |
2 x LAN : LAN1: Intel® I225V 2.5GbE controller LAN2: Intel® I225V 2.5GbE controller |
Audio | 1 x HD Audio : 1 x IAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin) |
I/O Interface | 2 x Internal RS-232/422/485 : 2x5 pin, P=2.00 ,RS-485 support AFC |
2 x External USB 3.2 Gen1x1 : 5Gb/s (Type-A) | |
2 x Internal USB 2.0 : 2x4 pin, P=2.00 | |
DIO : 12-bit digital I/O (2x7 pin) | |
1 x External USB 3.2 Gen2x1 : 10Gb/s (Type-C) | |
Expansion |
1 x PCIe x16 : signal from CPU via golden finger (supports x16, or x8 + x8, or x4 + x4 + x8) |
1 x PCIe x4 : signal from PCH via golden finger (supports x4, or x1 + x1 + x1 + x1) |
|
2 x M.2(NGFF) : 1 x M.2 A key (2230) with PCIe Gen3 x2/USB 2.0 1 x M.2 M key (2280/2242) with PCIe Gen3 x4 |
|
Power | |
Power Supply |
5V/12V, ATX/AT power supply Support AT/ATX mode ErP/EuP Compliant |
Environment | |
Operating Temperature | 0°C – 60°C |
Storage Temperature | -30°C – 70°C |
Humidity | 5% ~ 95%, non-condensing |
Certifications | |
Safety & EMC | CE/FCC compliant |
Ordering Information
HPCIE-Q470-R10 | Half-size PICMG 1.3 CPU Card supports LGA1200 Intel® 10th Gen. Core™ i9/i7/i5/i3/Pentium®/Celeron® CPU with Q470E, DDR4 SO-DIMM, HDMI™, USB-C, Dual Intel® 2.5GbE, USB 3.2, SATA 6Gb/s, M.2, HD Audio, iAMT and RoHs |
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Package Contents
Package Content |
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