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HPCIE-RPL-Q670
» Half-size PICMG 1.3 CPU Card supports LGA1700 Intel® 12th/13th/14th Gen. Core™ i9/i7/i5/i3/Pentium®/Celeron® CPU with Q670E
» Support 262-pin 5200 MHz Dual-Channel DDR5 So-DIMMs
» Double independent display via DP and HDMI™
» Support Intel® I226-LM and Intel® I226V 2.5GbE controller
» Support M.2 M key expansion
Hardware Spec.
| Form Factor | |
|---|---|
| Form Factor | Half Size Single Board Computer |
| System | |
| CPU | LGA1700 socket supports 12th/13th/14th generation Alder Lake-S Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor (up to 65W) |
| Chipset | Intel® Q670E/Q670 |
| Memory | two 262-pin 5200 MHz Dual-Channel DDR5 So-DIMMs |
| Memory Max. | 96GB |
| Cooling method / System Fan |
1 x CPU fan connector (1x4 pin) 1 x System fan connector (1x4 pin) |
| Physical Characteristics | |
| Dimensions (LxWxH) (mm) | 168 mm x 126 mm |
| Net Weight | GW:1000g / NW:420g |
| Storage | |
| Storage | 2 x SATA : 6Gb/s (RAID 0/1 supported) |
| 1 x M.2(NGFF) : M Key (2242, PCIe Gen3 x4) NVMe support | |
| I/O Interface | |
| Display Output | 1 x HDMI™ : 4K@30Hz |
| 1 x Display Port : 4K@60Hz, 180° | |
| Ethernet |
2 x LAN - LAN1: Intel® I226-LM 2.5GbE controller LAN2: Intel® I226-V 2.5GbE controller |
| Audio | HD Audio : 1 x iAUDIO, support IEI AC-KIT-888S Audio Module (2 x 5 pin) |
| I/O Interface | 2 x Internal RS-232/422/485 : 2x5 pin, P=2.00 (RS485 support AFC) |
| 4 x Internal USB 2.0 : 2x4 pin, P=2.54 | |
| 1 x DIO : 12-bit digital I/O (2x7 pin) | |
| 2 x External USB 3.2 Gen2x1 : 10Gb/s (Type-A) | |
| 1 x Internal USB 3.2 Gen2x1 : Type A 180° | |
| 2 x Internal USB 3.2 Gen1x2 : 2 X 10 pin P=2.00 (5Gb/s) | |
| 1 x I²C : 1x4 pin | |
| Expansion | Description: 1 x PCIe Gen3 x16 & 4 x PCIe Gen3 x1 signal via golden finger |
| Other Features | |
| TPM | Support TPM 2.0 (TPM-IN03 module) & Intel PTT |
| Power | |
| Power Consumption |
3.3V@0.05A, 5V@0.93A, 12V@11.33A, 5VSB@0.37A (Intel i9-14900 2GHz CPU with Apacer DDR5 5600MT/s SODIMM 32GB memory, EuP mode enabled) |
| Power Supply |
ATX/AT power supply Support AT/ATX mode ErP/EuP Compliant |
| Environment | |
| Operating Temperature | -10~60℃ |
| Storage Temperature | -30°C ~ 70°C |
| Humidity | 5% ~95%, non-condensing |
| Card Slot Interface | |
| M.2 | 1 x M.2 M Key (2242, PCIe Gen3 x4 ) NVMe support |
Ordering Information
| HPCIE-RPL-Q670-R10 | Half-size PICMG 1.3 CPU Card supports LGA1700 Intel® 12th/13th Gen. Core™ i9/i7/i5/i3/Pentium®/Celeron® CPU with Q670E, DDR5, HDMI,DP,Dual Intel® 2.5GbE, USB 3.2, SATA 6Gb/s, M.2, iAUDIO and RoHS |
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Package Contents
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